First Approach

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The primary proposed design for this project requires the use of CNC machining to fabricate the mold.  In this process, a SolidWorks design of the mold cavity will be created from the design parameters given by the sponsor.  The model will have five 0.05 mm (diameter) cavities for the placement of the electrode spheres.  A channel with a diameter of 0.25 mm will be engraved into the mold for placement of the lead wires.  The SolidWorks model for the mold cavities are shown below

Negative Image of Engraved Channel with First Design Approach using CNC machining (dimensions in mm).

 

Corresponding SolidWorks Model for Negative Image of Engraved Channel with First Design Approach (dimensions in mm).

 

In order to use CNC machining to fabricate the mold, the SolidWorks design must be converted into a MASTERCAM model.  This model will include a user programmed pathway that will yield the required drilling/milling path the CNC machine must take to fabricate the mold.  In addition, a stepper must be used to reach higher drill speeds around 30,000 rpm.  This stepper requires a housing component that would have to be manufactured before it can be utilized.  The mold will be fabricated out of 6061-T6 Aluminum, which was chosen for its strength per weight ratio, workability, and resistance to moisture.  Stainless Steel was the secondary choice for the mold material that was quickly ruled out by the team due to its extreme high cost.

            The procedure for fabricating the electrode ball contacts will not be changed from that already used by Dr. Clement’s research staff.  The process will still employ the use of 0.25 mm 90% Platinum and 10% Iridium wire.  A pre-measured segment of the wire will be exposed to a flame which will melt the tip into a ball-shaped electrode.  The mold that will be fabricated by the CNC machine will have five cavities with 0.5 mm diameters for the electrode balls to be placed in.  These cavities will be coated with PVA (Polyvinyl Alcohol) to prevent the electrode surfaces from being covered with silicone.  The team will run a series of impedance tests on the wire to determine how much surface area the silicone needs to cover to get the required impedance of 20 kΩ.

            The mold itself will consist of two halves.  The wires and electrode spheres will be placed into the bottom half in their respective channels/cavities.  The top half of the mold will be a mirror image of the bottom half without the electrode cavities.  Pins will be set on the outer diameter of the two molds to secure the piece together.  Silicone will be injected through holes situated axially to the mold cavity.  A pumping system will apply positive pressure to one end of the mold to inject silicone into the channels.  Negative pressure will be applied to the other side of the mold to draw the silicone through the channels.  The pumping system used in this design will be two syringes, one applying positive pressure and one applying negative pressure.

            After the silicone is injected through the system, the mold will then be placed on a hotplate at 65° C to cure the silicone.  The pins holding together the two mold plates will be removed and the electrode array will be run under hot tap water to wash off the PVA.  The final array itself will be examined and tested for any imperfections or errors.

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Last updated: 04/29/07.